This high speed Pick and place machine ht-f7 is applies to 0.6m,0.9m,1.2m rigid PCB and 0.5m,1m LED flexible strip. Max mounting height is 13mm. Mounting speed is 200000CPH. The speed is higher and the precision is higher . The mounting mode is group to mount and group to mount.
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Magnetic levitation technology, referred to as EML technology or EMS technology, refers to the use of magnetic force to overcome gravity to make objects suspended technology.
The system of magnetic levitation technology is composed of four parts: rotor, sensor, controller and actuator, in which the actuator includes two parts: electromagnet and power amplifier. assuming that the rotor is subjected to a downward perturbation in the reference position, it will deviate from its reference position. at this time, the sensor detects the displacement of the rotor from the reference point. the microprocessor as the controller converts the detected displacement into a control signal. then the power amplifier converts this control signal into a control current, which generates magnetic force in the performing magnet, thus driving the rotor back to its original equilibrium position. Therefore, the rotor can always be in stable equilibrium regardless of whether the rotor is disturbed downward or upward.
- Reflow soldering refers to the use of solder paste (a mixture of solder and flux) to connect one or more electronic components to the contact pad, through the control of heating to melt the solder to achieve permanent bonding, can be used back welding furnace, infrared heating lamp or hot air gun and other different heating methods to weld.
- Flow curve of reflux welding process
preheating zone: PCB and material preheating, so that the welded material to achieve thermal equilibrium,
Constant temperature zone: remove the surface oxide, some airflow start to evaporate (start welding) temperature to reach the solder paste melting point (this time the solder paste is in the insoluble state), this is the reflux furnace is the 5673 heating interval heating action
Back soldering zone: from the melting point of solder to the peak and then down to the melting point, the process of solder melting, PAD to form welding with solder, this is aimed at the back soldering furnace is the heating effect of 893 heating intervals.
Cooling zone: from the solder dissolution point down to about 50 degrees, alloy solder joint formation process.
Furnace temperature needs to be smooth, smooth, so that the flow of complete evaporation.
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Name:Brynn
Email :Brynn@eton-mounter.com
WeChat:13802252825
Telephone:138 0225 2825
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